Low-Temperature Solder Paste – MECHANIC XG-50 Sn63/Pb37 Clean & Eco-Optimized Formula 42g Description MECHANIC XG-50 Leaded Solder Paste is a low-temperature solder paste formulated with Sn63/Pb37 alloy for electronic assembly and repair. It features a clean, eco-optimized flux system designed to reduce residue, improve wetting, and provide stable solder joints during reflow. With a melting point of 183°C, this solder paste is suitable for mobile phone repair, SMD assembly, and PCB rework applications requiring controlled heat and reliable performance. The fine particle size ensures smooth printing, consistent solder deposition, and strong joint formation. Key Features * Leaded solder paste (Sn63/Pb37) * Low melting point: 183°C * Clean, low-residue flux formulation * Smooth solder flow and excellent wetting * Suitable for mobile phone repair and PCB rework * Designed for precision electronic soldering Specifications * Brand: MECHANIC * Model: XG-50 * Alloy: Sn63/Pb37 * Melting point: 183°C * Net weight: 42 g * Storage: Refrigerated at 0–10°C * Shelf life: 12 months نعتذر الشراء من الموقع متوقف مؤقتا We apologize : purchasing from our website is temporarily stopped
